Senior Product Engineer

The Senior Front End product engineer will be functionally report to Infineon's EWM TQTM (External Wafer Manufacturing, Technology, Quality and Transfer Management) BCD/RF team, responsible for front end product engineering topics of outsourcing BCD/RF products including NVM memory products. The qualified candidate will have in depth knowledge of product engineering, device and processes and thrive on resolving technical issues with external wafer foundry. He/She will understand semiconductor product material properties and their influence on semiconductor device behavior and the functional test yield(both wafer probing test and final test yield). In addition, applied expertise in front-end wafer fabrication processing and failure analysis will support career growth in this role.

In your new role you will:

• Lot assessment and disposition after wafer probing test and yield deviation analysis of production.
• Set up wafer stop limit (SBL and yield limit) for wafer probing test bins and define the scrap limit with Infineon internal team.
• Front End wafer probing yield monitoring and yield roadmap setup of BCD/RF products running in outsourcing wafer foundry.
• Co-work with Infineon EWM process integration and quality experts to improve processes to reduce production costs and increase yields for production.
• Be interface of wafer foundry and testing house, focal point for front-end process issues, low yield investigation & test parametric data analysis, support wafer probing yield assessments towards foundry process change and CIP/DOE lots as well as testing issue reduction for production.
• Co-work with internal technical team and external wafer foundry for root cause understanding of customer returns and final test failures of production.
• Work closely with the Infineon design team, product development team and test development team to solve yield problems before production(NPI stage).
• Support product release milestones and release both wafer probing testprogram and products from NPI stage to production as frond end product engineer role.
• Interface with internal and external customers to resolve technical issues requiring in depth product knowledge.
• Support wafer probing and final test specification alignment with Infineon internal experts.

You are best equipped for this task if you have:

• Min. Bachelor/Master Degree in Electronic Engineering or equivalent.
• Min. 4 7 years of working experience in Product Engineering, Test Engineering, or Device Engineering in the semiconductor field.
• In depth knowledge of BCD/RF/NVM products and processes.
• Knowledge of device fabrication process, such as Diff/IMP/CMP/Litho/Etch/CVD/PVD etc., including inline and electrical testing PCM items and their impact on device performance.
• Theoretical and practical knowledge of PN junction diodes, Schottky diodes, BJT, MOSFETs, capacitors, and resistors, etc.
• Good statistical knowledge (SPC).
• Experience with Mentor/Galaxy Examinator/ACE/PDF Exensio and JMP data analysis tools and Python/Tableau knowledge is desired.
• Excellent interpersonal, verbal, and written communication skills.
• Ability to demonstrate great attention to detail.
• Team player and self-motivated.

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