Advanced Packaging (3D) Program Director

We are looking for a dynamic 3D Integration Program Director who is passionate about research and development (R&D) and eager to drive innovation in telecom, network technologies, and 3D engineering.

Key Responsibilities

• Lead high-impact projects in AI/CPU, networking, and next-gen technologies to drive innovation.
• Develop and implement a cutting-edge 3D engineering architecture tailored to advanced application scenarios.
• Break down complex engineering structures into actionable plans, manage risks, and transform technical concepts into commercial successes.
• Conduct pioneering research and engage in global knowledge exchange with industry leaders in 3D integration technologies.
• Leverage your expertise in 3D IC, 3D packaging, and chip-to-chip technologies to shape the future of telecommunications, AI, and 5G.

Location: Leuven, Belgium

Candidate Skills and Requirement

• PhD in Engineering, Materials Science, or a related field - your expertise will drive innovation.
• 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.
• Strong technical knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
• Exceptional communication skills and a collaborative mindset to work with top industry experts.
• Proven leadership experience in managing complex projects and solving critical technical challenges.

Benefits

• Work alongside global experts and drive advancements in 3D integration.
• Competitive salary and benefits package.
• Opportunities for professional growth and development.
• Lead groundbreaking projects that will define the future of next-gen semiconductors and telecom technologies.
• Collaborative and innovative work environment.
• Flexible working hours and remote work options.
• Plenty of learning opportunities.